Series |
Image |
Dimensions |
Output Logic |
Supply Voltage |
Frequency Range |
Features |
Specifications |
FT5 |
|
5x7mm |
CMOS/TTL |
5.0V |
0.2MHz to 120MHz |
Military and space avaliable,high shock and vibration resistance, wide operating temperature range(-55℃ to +125℃),hermetically sealed ceramic package |
|
FT3 |
|
5x7mm |
CMOS/TTL |
3.3V |
0.2MHz to 200MHz |
Military and space avaliable,high shock and vibration resistance, wide operating temperature range(-55℃ to +125℃),hermetically sealed ceramic package |
|
FT2 |
|
5x7mm |
CMOS/TTL |
2.5V |
0.5MHz to 200MHz |
Military and space avaliable,high shock and vibration resistance, wide operating temperature range(-55℃ to +125℃),hermetically sealed ceramic package |
|
FT1 |
|
5x7mm |
CMOS/TTL |
1.8V |
0.5MHz to 165MHz |
Military and space avaliable,high shock and vibration resistance, wide operating temperature range(-55℃ to +125℃),hermetically sealed ceramic package |
|
FTL3 |
|
5x7mm |
LVDS/LVPECL |
3.3V |
0.75MHz to 1400MHz |
High speed ultra low jitter ,wide operating temperature range(-55℃ to +125℃),Military and space screening test available |
|
FTL2 |
|
5x7mm |
LVDS/LVPECL |
2.5V |
0.75MHz to 1400MHz |
High speed ultra low jitter ,wide operating temperature range(-55℃ to +125℃),Military and space screening test available |
|
FTL1 |
|
5x7mm |
LVDS/LVPECL |
1.8V |
0.75MHz to 1400MHz |
High speed ultra low jitter ,wide operating temperature range(-55℃ to +125℃),Military and space screening test available |
|
FTM5 |
|
5x3.2mm |
CMOS/TTL |
5.0V |
0.5MHz to 160MHz |
High shock survival,Low acceleration sensitivity,Hermetically sealed ceramic package |
|
FTM3 |
|
5x3.2mm |
CMOS/TTL |
3.3V |
0.5MHz to 160MHz |
High shock survival,Low acceleration sensitivity,Hermetically sealed ceramic package |
|
FTM2 |
|
5x3.2mm |
CMOS/TTL |
2.5V |
0.5MHz to 160MHz |
High shock survival,Low acceleration sensitivity,Hermetically sealed ceramic package |
|
FTM1 |
|
5x3.2mm |
CMOS/TTL |
1.8V |
0.5MHz to 160MHz |
High shock survival,Low acceleration sensitivity,Hermetically sealed ceramic package |
|
FTS5 |
|
3.2x2.5mm |
CMOS/TTL |
5.0V |
1.0MHz to 125MHz |
High shock survival,Low acceleration sensitivity,Hermetically sealed ceramic package |
|
FTS3 |
|
3.2x2.5mm |
CMOS/TTL |
3.3V |
1.0MHz to 160MHz |
High shock survival,Low acceleration sensitivity,Hermetically sealed ceramic package |
|
FTS2 |
|
3.2x2.5mm |
CMOS/TTL |
2.5V |
1.0MHz to 160MHz |
High shock survival,Low acceleration sensitivity,Hermetically sealed ceramic package |
|
FTS1 |
|
3.2x2.5mm |
CMOS/TTL |
1.8V |
1.0MHz to 160MHz |
High shock survival,Low acceleration sensitivity,Hermetically sealed ceramic package |
|
FTZ5 |
|
2.5x2mm |
CMOS/TTL |
5.0V |
0.5MHz to 12MHz |
High shock survival,Low acceleration sensitivity,Hermetically sealed ceramic package |
|
FTZ3 |
|
2.5x2mm |
CMOS/TTL |
3.3V |
0.5MHz to 125MHz |
High shock survival,Low acceleration sensitivity,Hermetically sealed ceramic package |
|
FTZ2 |
|
2.5x2mm |
CMOS/TTL |
2.5V |
0.5MHz to 125MHz |
High shock survival,Low acceleration sensitivity,Hermetically sealed ceramic package |
|
FTZ1 |
|
2.5x2mm |
CMOS/TTL |
1.8V |
0.5MHz to 125MHz |
High shock survival,Low acceleration sensitivity,Hermetically sealed ceramic package |
|